Dr. Tian Xia received his B.S. of Electronics and Information Engineering from  Huazhong University of Science and Technology, China, M.S. in Electrical Engineering from  Nanjing University of Posts and Telecommunications, China, and Ph.D. in Computer Engineering from the University of Rhode Island. During the summers of 2002 and 2003, he interned at the IBM T. J. Watson Research Center. In 2003, he joined the University of Vermont, where he is currently a professor in the Department of Electrical and Biomedical Engineering. His research focuses on mixed signal and radio frequency (RF) circuits, embedded systems, and their applications for sensing and communications. He received three times IBM Faculty Award between 2005 and 2008. He also received the Best Paper Awards in the Journal of Applied Remote Sensing (2021), IEEE System on Chip Conference (2012), and IEEE North Atlantic Test Workshop (NATW) (2005), respectively. He was honored with the IEEE Green Mountain Section "Leadership Award" (2011), and "Faculty of the Year Award" (2017). Most recently, he received  the "Excellence in Research Award" (2022) and the "Outstanding Faculty Award" (2025) from the College of Engineering and Mathematical Sciences (CEMS) at the University of Vermont. He is an associate editor of the Journal of Electronic Testing: Theory and Applications (JETTA), Springer, the Journal of Circuits, Systems and Computers (JCSC), World Scientific. Students graduated from his research group joined IBM, Global Foundries, Marvell Technology, Intel, Texas Instruments, Aptive, Omnivision, Qualcomm, Galen Healthcare Solutions, etc.