President, MicroStrain, Inc.
310 Hurricane Lane, Unit 4
Williston, Vermont 05495
Pennsylvania State University, 1977-1978
B.S. Engineering Science, University of Vermont, 1978-1981
M.S. Mechanical Engineering, University of Vermont, 1981-1984
December 1986-present President, MicroStrain, Inc., Williston, Vermont.
May 1981-December 1986 University of Vermont, Graduate Research Engineer, Dept. of Ortho. Surgery
September 1981-June 1984 UVM, Graduate Teaching Fellow, Mechanical Engineering
May 1978-May 1981 UVM, Student Research Assistant, Dept. of Ortho. Surgery
Professional Affiliations and Activities
Board of Advisors, UVM, College of Engineering & Mathematical Sciences (CEMS)
Board of Advisors, Vermont Center for Emerging Technologies (VCET)
Board Member, Vermont Science & Technology Council
Honors and Awards:
Gold award, Sensors Expo Chicago, June 2005, for wireless inertial sensing system (Inertia-Link)
Silver award, Sensors Expo Detroit, June 2004, for frequency agile wireless data acquisition system (Agile-Link)
Gold award, Sensors Expo Chicago, June 2003, for remotely powered and interrogated embedded wireless sensing system (EmbedSense)
Top Ten Techie, selected by New England Journal of Technology, Mass High Tech, August 2002
Gold awards, Sensors Expo San Jose, 2002, for 1) Micro-gauging DVRT (MG-DVRT-X) and 2) gyro enhanced orientation module (3DM-G)
Gold award, Sensors Expo Philadelphia, 2001, for gyro enhanced inclinometer (FAS-G)
Gold awards, Sensors Expo Chicago, 2001, for 1) Wireless Web Sensor Networks (WWSN) and 2) Fast Datalogging Micro-Transceiver (MDTxRx)
Vermont Small Business Innovator of the Year Award, to MicroStrain,Inc. for the development of Temperature Compensated Differential Variable Reluctance Transducer (DVRT-TC) for medical and automotive applications.
18 total: for selection see www.microstrain.com/scientific-papers.aspx#GGG
Current Research Focus:
The development of micro-miniature displacement, strain, force, and pressure transducers for medical, civil structures, & automotive applications. Design of low power microelectronic circuits for transducer signal conditioning, remote powering, re-programming, & wireless sensor data transmission.