University of Vermont

UVM Reseachers Receive IEEE Best Paper Award

Tian XiaBo JiangA paper by Tian Xia, associate professor in the School of Engineering (SoE) and Bo Jiang (Ph.D. student) entitled, "ADPLL Variables Determinations based on Phase Noise, Spur and Locking Time,” received Best Paper Award at The Institute of Electrical and Electronics Engineers (IEEE) International System on Chip Conference (SoCC) held September 12-14, 2012 in Niagara Falls, New York. 

“We are truly honored to receive this IEEE Award,” says Dr. Xia.

IEEE is the world’s largest professional association for the advancement of technology. IEEE SoCC is a top circuit design conference dedicated on emerging System on Chip technology. SoCC, in its 25th year, is a premier forum for sharing advances in applications in the areas of digital systems, architectures, methods, tools, automation, manufacturing, test, and emerging technologies.

Dr. Tian Xia joined the University of Vermont in 2003 with a B.E. degree in Electrical Engineering from Huazhong University of Science and Technology, China, an M.S. degree in Electrical Engineering from Nanjing University of Posts and Telecommunications, China, and a Ph.D. in Electrical and Computer Engineering from the University of Rhode Island. His research focuses on mixed signal VLSI circuit design and test. He is a senior member of IEEE- Computer Society, and IEEE- Solid State Circuits Society. Dr. Xia’s research involves: Mixed Signal Circuit Design and Test, Adaptive Multifunctional VLSI Circuit, and Reconfigurable Computing.

Bo Jiang received his BS degree in 2003 in Electrical engineering from Xi'an University of Technology and his MS degree in 2006 in Electrical engineering from Xi'an Jiaotong University. He joined UVM in 2007 and is working to complete his Ph.D in electrical engineering.

For more information contact: Tian Xia

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